JPH02738U - - Google Patents
Info
- Publication number
- JPH02738U JPH02738U JP7810388U JP7810388U JPH02738U JP H02738 U JPH02738 U JP H02738U JP 7810388 U JP7810388 U JP 7810388U JP 7810388 U JP7810388 U JP 7810388U JP H02738 U JPH02738 U JP H02738U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- heat dissipation
- dissipation device
- wrapping
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7810388U JPH02738U (en]) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7810388U JPH02738U (en]) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02738U true JPH02738U (en]) | 1990-01-05 |
Family
ID=31303052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7810388U Pending JPH02738U (en]) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02738U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051874A (ja) * | 2014-09-02 | 2016-04-11 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
-
1988
- 1988-06-13 JP JP7810388U patent/JPH02738U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051874A (ja) * | 2014-09-02 | 2016-04-11 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |